Why Chip Designers Are Turning to Carbon Nanotube Interconnects

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Why Chip Designers Are Turning to Carbon Nanotube Interconnects

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Episode 47 of The Hardware Podcast digs into the quiet shift happening inside chip fabrication lines: carbon nanotube interconnects. Lucas and Luna discuss why copper interconnects are hitting fundamental limits at the 2-nanometer node, how carbon nanotubes can carry more current with less resistance, and what TSMC and IBM have disclosed about their early research. They walk through a specific 2025 paper from the IEEE International Electron Devices Meeting that showed a nanotube-based test structure delivering 30 percent lower latency than copper at equivalent line widths. The episode also covers the manufacturing hurdles — alignment, density, contact resistance — and why this isn't a near-term replacement but a plausible mid-decade transition. Concrete, engineering-focused, and grounded in real data. #CarbonNanotubeInterconnects #ChipDesign #SemiconductorEngineering #TSMC #IBM #CopperLimits #2nmNode #IEDM #InterconnectScaling #Nanoelectronics #HardwarePodcast #Technology #ChipManufacturing #FexingoBusiness #BusinessPodcast #MaterialsScience #AdvancedPackaging #ResistanceCapacitance Keep every episode free: buymeacoffee.com/fexingo

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